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24 PCB007 MAGAZINE I SEPTEMBER 2023 packaging solutions such as 2.5D and 3D pack- aging, places significant demands on inspec- tion machines. For instance, inspection sys- tems must reliably address challenges like 10 mm thin solder deposits, 50 mm component spacing, and highly-reflective components within densely populated areas, even where access might be limited. Moreover, the proliferation of diverse advanced packaging methods, including fan- out wafer-level packaging (FOWLP), sys- tem-in-package (SiP), and chiplets, requires inspection machines to accommodate a wider variety of package types and configurations. In addition, the variation in component heights, a common characteristic in advanced pack- aging due to designs like stacked die and het- erogeneous packaging, requires the inspection system to overcome the shadowing created by these height differences in order to make con- sistent and reliable measurements. A Feature Q&A With Brent Fischthal KOH YOUNG Koh Young's Brent Fischthal explains how UHDI and advanced packaging are challeng- ing inspection systems. Advanced packaging seems to be accelerating the trend toward larger component packages. What are the new demands/challenges these packages put on inspection? e shi toward larger components and advanced packaging brings a host of chal- lenges that impact the industry. ese chal- lenges include complexity, density, package diversity, and inspection methodologies, all of which necessitate a more innovative approach. First, the increased complexity associated with advanced packaging techniques intro- duces more intricate board designs with mul- tiple chip types and miniaturized components. Furthermore, the drive toward higher den- sity and smaller pitch, facilitated by advanced Cutting-edge Inspection Challenges