PCB007 Magazine


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Page 5 of 115

6 PCB007 MAGAZINE I SEPTEMBER 2023 SHORTS Infographic: Advanced Packaging Capability Gap A Primer on UHDI PCB Industry Advocating with U.S. Government Officials HIGHLIGHTS MilAero007 Top Ten from PCB007 COLUMNS The Pros and Cons of Tribal Knowledge by Paige Fiet Why TDR? by Todd Kolmodin Don't Just Blame the Etcher by Don Ball Processes to Support IC Substrates and Advanced Packaging, Part 4 by Mike Carano Computer-aided Bare Board Testing, Revisited by Happy Holden ARTICLE Culture by Design: Building a Winning Team from the Start by Brian Wallace DEPARTMENTS Career Opportunities Educational Resources Advertiser Index & Masthead 36 42 50 82 88 46 105 114 115 23 28 86 40 102 SEPTEMBER 2023 • ADDITIONAL CONTENT 36 50 82

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