Issue link: https://iconnect007.uberflip.com/i/1507822
20 PCB007 MAGAZINE I SEPTEMBER 2023 will occur. IPC's 33-AP Ultra HDI Subcom- mittee is currently working on UHDI stan- dards from a system integration PCB product point of view, while SEMI and the IEEE are focused on the interposer as a high-volume element of heterogeneous integration pack- aging components, using substrate materials such as silicon, glass, and liquid dielectrics. e SLP and organic interposer will continue to use high-speed, low-loss PCB laminates, prepregs, or films. IC packaging already has a number of differ- ent packaging technologies. e introduction of silicon bridges and chiplets further differen- tiates them from PCB SLPs. But the Semicon- ductor Industry Association (SIA) Roadmap predicts a continuing reduction of packaging component pitch down to 0.10 mm pitch by Figure 2: Multichip and heterogeneous integration have created a number of different packaging substrates as well as the interposer. Advanced PCBs seeking to use fine-pitch components and advanced packaging need to utilize ultra-HDI geometries 2 .