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54 DESIGN007 MAGAZINE I OCTOBER 2023 Article by Anaya Vardya AMERICAN STANDARD CIRCUITS Ultra high density interconnect (UHDI) is a term used in the electronics industry to describe a cutting-edge technology that pushes the limits of fabrication capabilities for printed circuit boards (PCBs) and semiconductor devices. UHDI represents an advancement in miniaturization and integration, allowing for the creation of electronic components and sys- tems with extremely high levels of functional- ity in a smaller footprint. UHDIs are sub-1-mil (0.001") line widths and spaces, which neces- sitate that we change the unit of measurement from mils to microns. For reference, a 1-mil trace is 25 microns. In general terms, UHDI refers to traces and spaces on a printed circuit board that are sub-25 micron. As electronics continue to shrink, so does the printed cir- cuit board, not only in the X-axis, but also the Y-axis. Designers are challenged with reduc- ing the form factor as well as the thickness of printed circuit boards to meet these demands. is is where UHDI comes in. With every major advancement in technol- ogy comes manufacturing challenges. UHDI is UHDI Fundamentals: Ultra HDI Pushes PCB Manufacturing Capabilities

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