Issue link: https://iconnect007.uberflip.com/i/1509873
30 PCB007 MAGAZINE I OCTOBER 2023 bility for key lithography, metal deposition, and other processes to complete the 600-mm panel provided a challenging, yet achievable, target for equipment suppliers. New Materials e next generation of IC packaging is adapting to the demands of multi-die architec- tures. While silicon has supplied this require- ment, its cost and characteristics are not ideal. Glass and improved organic materials have emerged to fill this need. is strategy is very consistent with the dramatic and emerging changes in electronic systems, such as in high- performance computing (HPC), AI, and a new era of self-driving and electric cars that poten- tially think and drive better than humans. is requires device, packaging, and computing architecture paradigms with an entirely differ- ent vision and strategy than transistor scaling alone. Packaging, which can be viewed broadly as system scaling, is now viewed as replacing Moore's law for enabling better devices and better systems (Figure 3). Georgia Tech and its industry partners are developing a leading-edge glass packaging that is consistent with the needs in cost, perfor- mance, functionality, reliability, and miniatur- ization. In a technical article, they described the critical glass packaging technologies, and their R&D and commercialization status, as well as all the current and future applications. It compares glass packaging against other lead- ing-edge technologies, such as Si and embed- ded packaging. e requirement for the next-generation of substrate packaging must allow the shrinking geometries of interconnection and I/O pitch, lower dielectrics, and losses for the higher frequencies and suitability for the increased thermal heat dissipation required by all these devices. Glass is an ideal material, as it has Figure 3: Moore's law for packaging I/O means exponential evolution of I/Os in the past six decades. (Source: Georgia Institute of Technology 3 )