Issue link: https://iconnect007.uberflip.com/i/1510765
NOVEMBER 2023 I SMT007 MAGAZINE 31 ferent. Schools have become closed systems in general, as opposed to our program, which is more of a steppingstone in-between. A lot of students struggle going from purely academic to this, and might not know how to sell aca- demic skills in a professional setting. We know what we know, but we don't know how to translate that to industry, to prove that we are competent enough to work there. Redlin: Not knowing, that's kind of huge. Aca- demia, in general, doesn't provide a lot of real- world learning opportunities. But I think pro- grams like TCE teach you not only hard skills, but also so skills, like talking with people, and how to do internships, handle interviews, etc. Right. Thank you both for your time today. It was a pleasure talking to you. Redlin: ank you. Stam: anks, Nolan. SMT007 Benjemin Redlin Koh Young's Brent Fischthal explains how UHDI and advanced packaging are challenging inspec- tion systems. Advanced packaging seems to be accelerating the trend toward larger component packages. What are the new demands/challenges these packages put on inspection? Brent Fischthal: The shift toward larger components and advanced packaging brings a host of chal- lenges that impact the industry. These challenges include complexity, density, package diversity, and inspection methodologies, all of which necessitate a more innovative approach. First, the increased complexity associated with advanced packaging techniques introduces more intricate board designs with multiple chip types and miniaturized components. Furthermore, the drive toward higher density and smaller pitch, facilitated by advanced packaging solutions such as 2.5D and 3D packaging, places significant demands on inspec- tion machines. For instance, inspection systems must reliably address challenges like 10 mm thin solder deposits, 50 mm component spacing, and highly- reflective components within densely populated areas, even where access might be limited. Moreover, the proliferation of diverse advanced packaging methods, including fan-out wafer-level packaging (FOWLP), system-in-package (SiP), and chiplets, requires inspection machines to accom- modate a wider variety of package types and con- figurations. Continue reading... Cutting-edge Inspection Challenges