Issue link: https://iconnect007.uberflip.com/i/1511625
info @ atotech.com www.atotech.com Why dont you forget about DC plating For more information on our company or products, just scan the QR-code. Cuprapulse ® XP8 – New economical conformal pla ng process for MLB and HDI high AR applica ons Effective copper plating performance is defined by high throwing power (>90%) in through-holes combined with low surface thickness. Cuprapulse XP8 delivers this with excellent throwing power, ensuring precise copper deposition in through-holes with superior surface distribution and minimum copper plating thickness on the surface. DC technology cannot even come close to the throwing power of Cuprapulse XP8, which can achieve >23μm copper thickness inside the hole with only 25μm on the surface for an aspect ratio of >20. The higher applicable current densities, up to 5 A/dm², ensure the highest throughput in VCP and hoist type systems and offer customers new possibilities for MLB and HDI high AR applications offering unique throwing power performance and very uniform appearance, resulting in lower cost of ownership. In addition, less plated copper allows customers to save solder masks, anode material, and post-treatment processes and increases their overall productivity by up to 60%. What are you waiting for? Contact us today.