Design007 Magazine

Design007-Jan2024

Issue link: https://iconnect007.uberflip.com/i/1514189

Contents of this Issue

Navigation

Page 5 of 85

6 DESIGN007 MAGAZINE I JANUARY 2024 COLUMNS Pulling Together by Andy Shaughnessy Five Best Practices for Designing Flex and Rigid-flex PCBs by Matt Stevenson What Matters When Designing Next-generation Products by Joe Fjelstad INTERVIEW IPC Design Competition: Third Time's the Charm by Andy Shaughnessy HIGHLIGHTS MilAero007 Flex007 Top Ten Editor's Picks DEPARTMENTS Career Opportunities Educational Resources Advertiser Index & Masthead SHORTS Earthquake Temporarily Halts Silicon Wafer, MLCC, and Semiconductor Facilities in Japan Chung-Ang University Scientist Develops New Antiferromagnetic Superconducting Spin Valves PCB Market to Grow by $19.05 Billion from 2022 to 2027 Redefining Energy Efficiency in Data Processing 9 63 68 73 8 64 70 28 40 58 74 77 84 85 JANUARY 2024 • ADDITIONAL CONTENTS 64 70

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - Design007-Jan2024