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JANUARY 2024 I DESIGN007 MAGAZINE 73 It's increasingly important to learn how best to mitigate or eliminate these concerns, and the designer must learn the best grounding prac- tices as well as how to employ the best shield- ing techniques and incorporate EMI filters. In general, they need to follow established elec- tromagnetic compatibility (EMC) guidelines. My last item on this much-abbreviated list is meeting regulatory compliance requirements, which can determine whether your product can make it to the market. is means that the designer (or someone on the product design team) must stay informed about regulatory standards, perform pre-compliance testing, or, alternatively, involve regulatory experts and consultants early in the design process to ensure all aspects of the relevant laws and reg- ulations are followed. In summary, it is crucial to approach non- standard PCB designs systematically, with a careful mindset, and considering all relevant electromechanical and thermal concerns as well as those that are regulatory, to ensure a successful product build. Close collaboration between PCB designers and experienced man- ufacturers is frequently the key to circumvent- ing problems. DESIGN007 Resources 1. For more on the subject, read "Flexible Thinking: DFM or Design With Manufacturing?" Joe Fjelstad is founder and CEO of Verdant Electronics and an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 185 patents issued or pending. To read past columns or contact Fjelstad, click here. Download your free copy of Fjelstad's book Flexible Circuit Technology, 4th Edition, and watch his in-depth workshop series "Flexible Circuit Technology." As information and communication technolo- gies (ICT) process data, they convert electricity into heat. Already today, the global ICT ecosystem's CO 2 footprint rivals that of aviation. It turns out, however, that a big part of the energy consumed by computer processors doesn't go into performing calculations. Instead, the bulk of the energy used to process data is spent shuttling bytes between the memory to the processor. According to Andras Kis, who led the study, the main culprit behind the inefficiency of today's CPUs is the universally adopted von Neumann architec- ture. Specifically, the physical separation of the components used to per- form calculations and to store data. Because of this separation, proces- sors need to retrieve data from the memory to per- form calculations, which involves moving electrical charges, charging and dis- charging capacitors, and transmitting currents along lines, all of which dis- sipate energy. The choice of material—MoS 2 —played a vital role in the development of their in-memory processor. For one, MoS 2 is a semiconductor, a requirement for the development of transistors. Unlike silicon, the most widely used semiconductor in today's computer processors, MoS 2 forms a stable mono- layer, just three atoms thick, that only interacts weakly with its surroundings. Its thinness offers the potential to produce extremely compact devices. Aside from its purely scientific value, Kis sees this result as a testament to the importance of close scientific collabora- tion between Switzerland and the EU, in particular in the context of the European Chips Act, which aims to bolster Europe's competi- tiveness and resilience in semiconductor technolo- gies and applications. (Source: EPFL) Redefining Energy Efficiency in Data Processing