PCB007 Magazine

PCB007-Jan2024

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52 PCB007 MAGAZINE I JANUARY 2024 Materials Over the years, several materials have been developed for use with LoC and LoPCB. It started in the late 1990s with silicon, as the microelectronics industry developed various methods of MEMS for accelerometers for air bag sensors. From silicon wafers, the materials branched out to glass and then polymers. e most recent interest has been in PCBs and the use of various paper materials. Silicon and glass have several advantages for fabricating LoC, but they are the most expen- sive. Polymers and especially PCBs are newer choices because of various available materials and the integration of electronics and types of printing technologies. While some research Elements of the Lab-on-PCB e component devices that make up a typi- cal LoC and LoPCB are: • Electrophoresis fluid movement • Microfluidics: Channels, valves, pumps, and mixers • Separation columns • Heating: Cooling and mixing • Reaction chambers • Reagent additions • Chem-bio detectors and sensors • UV-VIS/colorimeter sensors • Microfluidic chips ese units combine into a functioning labo- ratory (Figure 2) schematic from Agilent. Figure 2: Schematic of a typical micro-TAS on a chip or board. (Source: Agilent Technologies)

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