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28 DESIGN007 MAGAZINE I FEBRUARY 2024 tries, the placement of components on internal layers, and the routing to them. e reliability of PCBs with embedded com- ponents, compared to traditional boards, is a nuanced consideration that depends on vari- ous factors. While embedded components offer many advantages in terms of reduced external exposure and enhanced thermal per- formance, their integration comes with a set of challenges and considerations. Designers need to carefully assess additional factors as they must balance advantages and challenges. Advantages of Embedding Components • Space efficiency: Integration within PCB layers significantly reduces the overall footprint, which is crucial for compact and portable devices • Improved signal integrity: Shorter signal paths minimize signal degradation, inter- ference, and electromagnetic emissions, especially in high-frequency applications • Reliability and durability: Shielded within the PCB layers, embedded compo- nents are less susceptible to external fac- tors and enhance device reliability • Enhanced thermal performance: Proxim- ity to PCB layers allows efficient heat dissi- pation—especially critical for applications with heat concerns—preventing overheat- ing and potential damage • Shorter signal paths: Improved signal integrity enhances reliability and is crucial in high-frequency applications • Manufacturing simplification: Fewer external components streamline the assembly process, reducing errors, enhancing manufacturing efficiency, and contributing to cost savings Embedded Component Challenges • Accessibility and repairability: Embed- ded components pose challenges for test and repairs due to limited accessibility, impacting reliability • Material selection: Careful selection of materials is crucial for longevity and reliabil- ity, taking insulation, thermal conductivity, compatibility, and long-term stability into consideration, as these are vital for prevent- ing issues like delamination, warping, or ther- mal expansion, thus preserving reliability Figure 2: A 3D view of embedded components.