Issue link: https://iconnect007.uberflip.com/i/1515637
FEBRUARY 2024 I DESIGN007 MAGAZINE 9 Andy Shaughnessy is man- aging editor of Design007 Magazine. He has been covering PCB design for 23 years. To read past columns, click here. and manufacturing hurdles that can trip up designers who are new to this tech- nology. In this issue, our expert contribu- tors lay down the foundation of knowl- edge that designers need to be aware of to make intelligent, educated decisions about embedded design. We start with a conversation with IPC's Kris Moyer, who teaches embed- ded design techniques. He provides an overview of the design and manufac- turing steps related to embedding com- ponents. John Andresakis discusses embedded resistor copper foils, their design challenges and benefits, and some resources available to designers working with embedded components. Next, col- umnist Vern Solberg offers some handy tips, tricks, and techniques for design- ing with embedded components. Ste- phen Chavez explains how designers can "unleash the power" of embedded com- ponents and make their boards more reli- able and oen less costly—with the right pre-planning. Cody Stetzel has a feature that out- lines all the different types of embedded capacitors on the market today. Colum- nist Barry Olney takes a signal integrity engineer's view of embedded capaci- tance materials and breaks down their challenges and benefits. Our own PCB historian, Joe Fjelstad, traces the devel- opment of embedded component tech- nology from its postwar roots through today. We'll bring you coverage of DesignCon and IPC APEX EXPO in the next few months, so stay tuned. DESIGN007 Cadence Design Systems has announced Cadence Celsius Studio, the industry's first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and ther- mal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. While current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation. The industry's first complete AI thermal design and analysis solution for electronic systems, Cadence Cel- sius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addi- tion to electronics cooling for PCBs and complete elec- tronic assemblies. The industry's first complete AI thermal design and analysis solution for electronic systems, Cadence Cel- sius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addi- tion to electronics cooling for PCBs and complete elec- tronic assemblies. Celsius Studio brings a new system-level thermal integrity solution into the marketplace, converging electro-thermal co-simulation, electronics cooling and thermal stress into one cohesive offering. (Source: Cadence Design Systems) Cadence Advances ECAD/MCAD Convergence with Celsius Studio AI Thermal Platform