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32 SMT007 MAGAZINE I MARCH 2024 Get Real About Digital Twin and Artificial Intelligence It seems like every time you turn around, you see another article or social media post about the approach wave of digital twin and artifi- cial intelligence for our industry. APEX EXPO 2024 and the Electronic Circuits World Con- vention (ECWC16) Technical Conference provide the opportunity to gain real-world knowledge about these applications and stan- dards that are underway and in the pipeline to provide ease of adoption. e Generic Requirements for Digital Twin Task Group will meet from 10:15 a.m. to noon Wednesday, April 10, to seek industry feed- back on opening IPC-2551, International Stan- dard for Digital Twins, for revision or amend- ment. In addition, the task group leadership will share recent updates on the development of supporting standards to feed into the IPC- 2551 standardized digital twin architecture, as well as the development of JSON descriptions to support the standard. Also plan to attend the Model Based Defi- nition (MBD) for Digital Twins Task Group meeting, where you will learn about IPC/ DAC-2552, General Electronic Components Model Based Definition (MBD). Task group leadership will share plans for its first version update and recent discussions to utilize the IPC/DAC-2552 framework as a baseline to create sister standards for MBDs to support board design and assembly. at group meets from 3:15 to 5 p.m. Tuesday, April 9. In addition to the standards development meetings, digital twin and AI sessions during ECWC16 will be the place to be. ese tech- nical presentations are from 10 a.m. to noon Tuesday, April 9, and 1:30 to 3 p.m. Wednes- day, April 10. Presentation titles are listed below: • "Achieving Equipment Orchestration rough Equipment Integration" Presenter: Yu Xian Ang, camLine Sdn. Bhd. Shi • "Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences" Presenter: Mohan Rangan Govindaraj, Siemens EDA • "Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks" Presenter: Ryusuke Ueki, Qualtec Co., Ltd. • "Factory of the Future: Automating Simulation Creation as Part of a Digital Twin Initiative" Presenter: Craig Dickson, Flex Ltd • "How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process" Presenter: Wei Ken Hee, Vitrox Technolo- gies Sdn Bhd • "Machine Learning-Based Solderability Check of THT Solder Joints" Presenter: Reinhardt Seidel, Ph.D., Friedrich-Alexander-Universität Erlangen-Nürnberg, Lehrstuhl für Fertigungsautomatisierung und Produk- tionssystematik (FAPS) If that isn't enough, two of our industry key- notes will have their own AI flair.