IPC International Community magazine an association member publication
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IPC COMMUNITY 79 SPRING 2024 Standards are pivotal in ensuring industry efficiency, and IPC Asia is committed to spear- heading their development and adoption. Our key areas of focus encompass advanced packag- ing, factory of the future, and sustainability for electronics. Anticipated standards will address IC substrates, system in package (SIP), and wire bonding, scheduled for release by late 2024. We actively promote the adoption of crucial stan- dards like Connected Factory Exchange (CFX) and Model Based Definition (MBD). Addition- ally, we plan to offer training and audits in line with the IPC-1401 Supply Chain Social Responsi- bility Management System Guideline. IPC's presence in critical markets like China, Japan, and South Korea is steadily expanding. We strive to bolster this influence by enhanc- ing member communications and services, fostering collaborations with local entities and governments, and organizing industry events such as CEMAC in China, K-Fest in South Korea, and advanced packaging symposiums in Japan. These efforts are geared toward fostering greater international cooperation within the electronics industry. We anticipate attending IPC APEX EXPO 2024, featuring a record number of Asian exhibitors. Come visit our IPC Asia booth, #4352, to con- nect with our team. India By Manvi Kapoor, Deputy Manager, Events and Communication, IPC India Q1 was a busy time for the IPC India team. It started with a technical session on hand sol- dering in Kolkata on Jan. 6. The IPC Skills Devel- opment Program successfully showcased its commitment to enhancing the skills and knowl- edge of professionals in the electronics man- ufacturing and electronics assembly industry. It was more than just a learning experience, as IPC continues to fuse education with collabora- tion, empowering professionals in the electron- ics field with essential knowledge and valuable connections. On Jan. 30, the IPC Standards Development Committee for the India region convened in Bengaluru. During this session, there were in-depth discussions on IPC-2232, Guideline for Printed Board Design and Manufacturing of IoT Products, and IPC-9911, Guideline for Auto- motive Electronics Printed Board Thermal Man- agement & Electronic Components. These dis- cussions were facilitated by electronics design companies, alongside electronics manufactur- ing services (EMS) and wire harness members from India, Malaysia, UAE, South Africa, and Sri Lanka. A total of 22 participants joined both physically and virtually to deliberate on IPC-A-610, IPC J-STD-001, and IPC-A-620. IPC planned the Integrated Electronics Manu- facturing & Interconnections (IEMI 2024) road- show in Penang, Malaysia, on Feb. 6, engaging major stakeholders in the region and discussing its initiatives on advanced packaging of semi- conductors. This global industry networking event is scheduled to take place in Penang on July 24–25. In Q2, IPC India is preparing for hand solder- ing competitions in Delhi, Pune, Bengaluru, and Chennai, April through June. Anticipation is high within the industry, with expectations for significant interest and participation.