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86 SMT007 MAGAZINE I MAY 2024 ing signs of higher warpage at MSL3 (14, 27, and 40 mm) and three that do not show higher warpage. ere is another previously undiscussed variable related to the moisture exposure of the samples, which is die-to-mold ratio sum- marized in Table 3. Exact numbers on die-to- mold ratio are either unknown or kept vague to protect company information. Adding this variable to our data set, a clear trend is shown that samples with more molded area, relative to die size, will absorb moisture and cause larger effects on thermal warpage at higher temperature. A final attempt is made to better interpret the 10 x 11 mm and 11 x 12 mm data to see if any trend related to moisture can be found. Using the relative warpage data second-order poly- nomial, trendlines are fit to the average copla- narity data. e general curve of the relative warpage fits the general second-order curve shape. Figures 23 and 24 show the trendlines Table 3: Die-to-mold ratio of test samples Figure 23: Average relative coplanarity, second-order polynomial fit, 10 x 11 mm.