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168 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2024 SHOW & TELL MAGAZINE by Teresa Rowe • IPC S tandards development activities drew a large crowd of committed volun- teers to IPC APEX EXPO 2024. Subject matter experts from around the world came together to work on standards for new and established technologies, and this included welcoming a large international audience. Participants were able to attend standards development discussions on topics such as design, materials, board fabrication, micro- via reliability, assembly, cleaning, coating, advanced packaging, factory automation, and materials declaration. There was also a "first" when the IC substrates working group welcomed leadership from China for its first international meeting of the group develop- ing IPC-6921. The Technical Activities Executive Commit- tee (TAEC) welcomed new leaders Steven Bowles of Lockheed Martin, and Udo Welzel of Robert Bosch GmbH. The TAEC Global reviewed the status of current projects and discussed standards strategy during their meeting. For the second year, IPC welcomed all com- mittee members who worked on projects completed in the past year to a Committee Appreciation event. Team members were celebrated for their achievements and had an opportunity to meet and greet other team members and IPC staff. A few days later, Milea Kammer of Honeywell Aerospace was named the winner of the Kessler–Goldman Award for Committee Leader of the Year, and Tom Marktscheffel of ASMPT GmbH & Co. KG, was named the winner of the Hill- man–Lambert Award for Committee Mem- ber of the Year. As a result of the standards development meetings at IPC APEX EXPO 2024, IPC will be opening new projects and form- ing new task groups in the coming weeks. Industry volunteers interested in contrib- uting to these proj- ects are encouraged to participate. S&T Teresa Rowe is senior director of IPC assem- bly and standards technology. A Roundup of Standards Committee Activity