Issue link: https://iconnect007.uberflip.com/i/1524755
52 SMT007 MAGAZINE I AUGUST 2024 Current trends in microelectronic packag- ing technologies continue in the direction of smaller, lighter, and higher density packages. e telecommunications industry and partic- ularly mobile/portable devices have a strong need for lighter and smaller products. e current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation. e AP covers a set of inno- vative technologies that package integrated cir- cuits (ICs) to increase functionality, improve performance, and provide added value 1 . In contrast, traditional packaging methods cover different I/O density and I/O pitch depend- Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle ing on the targeted application's requirements, performance, and cost. e AP with hetero- geneous integration added additional thermal challenges compared to a single die package 2 . For single-die packaging technologies, the density requirement led to a progression in ball-grid-array (BGA) packaging technologies implemented in early 2000. With increased I/O density and decreased package size, the new generation of fine pitch BGA (FPBGA) packages, such as chip scale packages (CSPs) are introduced. A variety of studies have been conducted examining the reliability of printed circuit board assemblies (PCBAs) using BGAs and FPBGAs 3-6 . Recently, a guideline on BGA and die size BGA (DSBGA) was released for Article by Thomas Sanders, Seth Gordon, and Reza Ghaffarian JET PROPULSION LABORATORY, CALIFORNIA INSTITUTE OF TECHNOLOGY, PASADENA, CALIFORNIA