PCB007 Magazine

PCB007-Aug2024

Issue link: https://iconnect007.uberflip.com/i/1525368

Contents of this Issue

Navigation

Page 64 of 101

Global Ultra High Density Interconnect Feature and Process Control System for improved fine feature imaging to 4 µm. Improved dynamic registration technology to improve laser to mechanical drill registration. Increased throughput via offline registration technology. High power, Quad-wave, data streaming light engine for high resolution imaging. Multiple resolutions including 4, 6, 15, 30 µm features for conventional processes. External Rasterization provides 10x percision for fine feature adjustment on the fly. Sub-1 mil UHDI Capability High Throughput Automation Ready 15,6,4, and 1 µm available SAP proven to 10 µm MivaTek Global, LLC, 6 Dickinson Drive, Suite 218, Chadds Ford, PA 19317 Website: www.MivaTek.Global Contact: Brendan Hogan M (610) 620-3795 b.hogan@MivaTek.Global

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Aug2024