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SEPTEMBER 2024 I DESIGN007 MAGAZINE 55 e number of die elements to be integrated onto a single silicon-based interposer will be dependent on the size of the die elements and complexity of the die and the area available for interconnect. One to three small outline die may be considered viable for the 10 mm and 12 mm square interposer while the larger outline interposers may include mounting and inter- connecting five or more die-level elements. e factors furnished in Table 2 define capa- bility in both standard and advanced silicon- based interposer applications. Note: e factors outlined in the above table are all subject to change as technology advances and market trends evolve. Warning: When adopting bare, uncased die elements, the designer must consider that suppliers may need to physically alter their semiconductor design without notice. e changes may be to cor- rect a defect or improve yield, but oen, the redesign is to reduce the die outline in order to enable a greater die element population on the silicon wafer base. Although the indi- vidual die elements may continue to be furnished with a uniform terminal format, the die element outline, ter- minal size, and pitch will probably shrink, and if the die outline and/or terminal pattern are changed, a new interposer or package sub- strate will need to be developed. Note: e content of this article is drawn from PCB Design Engineers Handbook for Surface Mount and Microelectronics by Vern Solberg. DESIGN007 Vern Solberg is an independent technical consultant, specializ- ing in SMT and microelectronics design and manufacturing tech- nology. To read past columns, click here. Table 1: Circuit design guide for silicon-based interposer fabrication (Data source: IPDiA) Table 2: Component population guide for silicon-based interposers