Issue link: https://iconnect007.uberflip.com/i/1528798
NOVEMBER 2024 I SMT007 MAGAZINE 41 herself grappling with a recurring solder bridging issue that was affecting overall first- pass yield (FPY ). e defect data was there, but it was scattered and difficult to interpret. Implementing an advanced analytics platform allowed the quality team to conduct a histor- ical "top 10 defects" analysis, enabling them to quickly zero in on the most prevalent (and costly) issues. e team carefully analyzed the SPI machine data for a specific product assembly with repeated incidences of bridging and excess sol- der defects. e detailed analysis allowed them to correlate defects with specific solder paste printing process parameters. Upon investiga- tion, a slight misalignment of the stencil and sub-optimal squeegee pressure contributed to the problem. Armed with this information, the Figure 2: Software helps normalize the data across different machine brands. Figure 3: Using a careful analysis of SPI machines for a specific product assembly with repeated incidences allowed for the team to correlate defects with specific solder paste printing process parameters.