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26 SMT007 MAGAZINE I DECEMBER 2024 solder joint could be kept at a constant value during the vacuum with the help of the heater integrated in the chamber. Summary All modern vacuum soldering processes offer the possibility of reducing the porosity in the soldering joints through flexible vacuum man- agement. A list of the available processes shows that, despite a common goal, the possibilities and areas of application of the soldering pro- cesses differ greatly. To find the right soldering system, the individual requirements and frame- work conditions must be defined in detail. Table 1 shows some of the key features of the previously discussed soldering processes with vacuum. Particular attention can be paid to the type of assemblies to be processed, the maxi- mum temperature and productivit y. SMT007 References 1. "Galden in the vapor phase soldering process for connectors," by Dr. Karen Hergert and Dr. Paul Wild, Rehm Thermal Systems, industr.com. Dr. Paul Wild is R&D manager at Rehm Thermal Systems GmbH. Figure 8: Temperature profile with vacuum of a soldering process with a soldering system. Dr. Paul Wild was recognized with an IEC 1906 award in 2022. Table 1: Comparison of key features of contact, convection, and condensation soldering systems with vacuum