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36 SMT007 MAGAZINE I DECEMBER 2024 e semiconductor industr y is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physi- cal and economic barriers, transistor density can no longer double ever y two years with- out escalating costs and complications. As a result, the industr y is shiing its focus from chip-level advancements to innovative pack- aging and substrate technologies. is evo- lution is driving the exploration of advanced packaging techniques, such as 2.5D and 3D architectures, and chiplet designs, all of which offer new avenues to continue performance improvements and overcome the limitations of traditional scaling. Advanced packaging has emerged as a criti- cal enabler in this new era, allowing multiple chips to be integrated within a single pack- age, thereby enhancing performance, power efficiency, and overall system reliability. By stacking chips vertically or placing them side by side in a more connected manner, these technologies significantly reduce power con- sumption, improve data transfer speeds, and The Era of Advanced Packaging The Knowledge Base by Mike Konrad, SMTA