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38 SMT007 MAGAZINE I DECEMBER 2024 enable greater functionality within a smaller footprint. is shi is not just about over- coming the limits of Moore's Law but redefin- ing how electronic systems are designed and manufactured, setting the stage for continued innovation in high-performance computing and beyond. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight. Mike Konrad: How do you see Moore's Law evolving in the context of advanced packag- ing technologies? Dr. Nava Shpaisman: Moore's Law, which pre- dicted transistor density to double ever y two years, has guided the industr y for decades. However, shrinking transistors to minuscule sizes is no longer sustainable due to high costs and physical limitations. As leading-edge node architecture becomes more complex, integrating multiple dies into a single package becomes crucial. Advanced packaging provides designers with a solution to overcome these limitations by arranging multiple chips in three-dimen- sional structures and creating direct connec- tions between them. An added advantage is the ability to place chips with different func- tions close to each other, resulting in increased speed and reduced power consumption and cost. By simplifying multi-function devices into a single package, we can continue improv- ing chip performance without solely relying on transistor size reduction. In addition to improving performance, power distribution and interconnect density, heterogeneous integration has also proven to be a cost-effective method for integrating multiple functions in packaging instead of on a wafer. With updated 2.5D and 3D architec- tures serving various end-applications, hetero- geneous integration continues to accelerate, opening endless possibilities. It's also making it more challenging to attain reliable electrical connections between different components with varying process technologies. What are the key challenges that the industry faces in this transition to advanced packaging? Moving to advanced semiconductor pack- aging involves several key areas. Compo- nents are shrinking and becoming more pow- erful, so managing heat dissipation becomes critical. Efficient thermal solutions prevent overheating and ensure long-term reliabil- ity. Smaller components demand finer pitches and tighter spaces. Ensuring robust intercon- nects while avoiding signal integrity issues in densely packed designs is a challenge. Integrat- ing diverse materials (dielectrics, metals, and substrates) can cause reliability issues due to differences in coefficients of thermal expan- sion (CTE), making compatibility and reliabil- ity across material interfaces essential. Handling ultra-thin substrates without compromising mechanical strength adds another layer of complexity. Advanced pack- aging techniques involve complex processes, increasing manufacturing costs; achieving high yields during production is crucial for cost management. Validating complex pack- ages requires advanced testing methods, and ensuring reliability throughout the prod- uct's lifecycle remains a persistent challenge. Dr. Nava Shpaisman