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24 SMT007 MAGAZINE I DECEMBER 2024 ture allows three-dimensional soldering on dif- ferent soldering levels without exceeding the maximum temperature or time via liquidus. In addition to reducing the porosity, the vac- uum in the smart soldering system also con- tributes to the complete drying of the ther- mally conductive medium residues. Partic- ularly in the case of components with many cavities (such as connectors) in which the medium accumulates, the vacuum prevents it from being carried away 1 . Convection Soldering With Vacuum System technology Convection soldering is the most used sol- dering process in electronics production. Around 80% of all soldering systems in elec- tronics production are based on this heat trans- fer principle. As shown in Figure 7, the vacuum chamber is installed in a convection reflow soldering sys- tem of the convection soldering system as a sup- plement to existing peak zones. e mechanical design of the system offers the option of either using the vacuum or using it as a classic convec- tion soldering system. A particular advantage of this system is the large number of hardware and soware-based aids to make profiling the vacuum in the chamber faster and more user- friendly. For example, the vacuum test method is used to determine the cycle time of the pro- cess depending on the dimensions of the assem- bly, the vacuum, the holding time, etc. Profiling Figure 8 shows the temperature profile of a convection soldering process with vacuum. In this application with 100 mbar vacuum, all pro- file specifications (≤ 3 K/s heating, t L ≤ 90 s, T P ≤ 464°F) were met. e temperature of the Figure 6: Temperature and pressure profile for realizing identical temperature curves with different product heights. Figure 7: A convection soldering system.