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40 SMT007 MAGAZINE I DECEMBER 2024 GPU packages integrate GPU processor chips and multiple stacked HBM memory modules in proximity inside the same package. e challenge for packaging designers is bal- ancing performance with power efficiency, and reliability. As we continue to see innovation accelerated in heterogeneous integration with new 2.5D and 3D architectures, the industry is developing more efficient ways to achieve high interconnect density to meet performance and cost requirements. Heterogeneous integration methods include hybrid bonding, embedded bridges, wafer and panel interposers, glass core substrates, and, in the long term, co-packaged optics. Each of these delivers breakthroughs in packaging interconnect density for chips targeting high- performance apps. However, they also pose new process and process control challenges across wafer-level packaging, assembly, and substrate manufacturing. Many of the advancements achieved in pack- aging will also target the substrate and panel- level. For example, to support more connectiv- ity over a smaller surface, advanced substrates are characterized by high layer count, large unit size, and fine lines. IC substrates (ICS) pose unique chal- lenges for manufactur- ers, specifically when it comes to patterning large unit size, high layer count, fine-line build-up film substrates of uneven topography. In the shi to package- centric design, ICS manufactur- ing yield is key to achieving breakthroughs in performance, power efficiency, and reli- ability of electronic systems. ICS manufac- turers that want to accelerate their yield curve need to adopt increasingly high sensitivity for inspection, customized to account for different handling, noise sources, warpage, and thick- nesses found in packaging applications. For manufacturers seeking leadership in packaging innovation, there is a significant opportunity to bridge methodologies across the three worlds of front end, packaging, and substrates. KLA's process and process control method- ologies bring the precision of front-end semi- conductor manufacturing to the dynamic realm of customized packaging. Manufactur- ers need front-end-like inspection and metrol- ogy capabilities, which is what KLA provides. What role do materials science and substrate innovations play in the future of semiconduc- tor packaging, and which materials are currently leading the way? Materials science and substrate innovations are crucial in advancing semiconductor pack- aging technology. Choosing the right materi- als requires balancing performance, reliability, and cost. Some advanced packaging materials include low-loss materials, which are crucial for high-frequency and high-speed applica- tions. For mechanical stability and warpage p r e v e n t i o n , t h e s e m a te r i - als must maintain a high Young's modulus. While choosing the set of materials com- prising the package, s u c h a s d i e l e c t r i c , molding compound, soldering material, etc., designers and manu- facturers must match the coefficient of ther- mal expansion (CTE) to the silicon die, to avoid structural fail- ure s s uch a s f r ac ture and cracking within the packaging during thermal processes. In choosing among silicon, organic, or glass interposer materials, performance, reliabil- ity, and cost must be considered. While sili-