Issue link: https://iconnect007.uberflip.com/i/1529988
42 SMT007 MAGAZINE I DECEMBER 2024 con interposers offer excellent electrical per- formance and thermal conductivity and can be expensive and prone to warpage, organic inter- posers are cost-effective and have a better CTE match with the substrate, but with lower ther- mal conductivity. Glass interposers have supe- rior electrical performance and a CTE closer to silicon. However, they are fragile and require specialized manufacturing processes. Lastly, alternative bonding materials, such as bumping and Cu pillars, enable smaller pitch sizes. rough-silicon vias (TSVs) allow stacking dies vertically. However, there are challenges to consider, such as thermal management, reliabil- ity, electromagnetic interference (EMI), cost- effectiveness, and supply chain stability. How does the trend of integrating more compo- nents within a single package influence thermal management, and what innovations are being developed to address these challenges? It is possible to shorten signal paths and still properly dissipate heat on a single die. How- ever, multiple dies in a package require thinner substrates and dielectrics to ensure that signals travel fewer distances, which reduces thermal dissipation. " In choosing among silicon, organic, or glass interposer materials, performance, reliability, and cost must be considered. " Materials with similar CTEs minimize these stresses, reducing premature failure risks and other thermally induced effects, such as accel- erated aging, reduced electron mobility, or analog or optical signal dri. Heterogeneous integration requires a fun- damental understanding of the thermal expan- sion properties of every material. is could ultimately affect the packaged device's reliabil- ity and yield. at's only part of the problem. Advanced packaging requires an understand- ing of what else is near a chip or chiplet, and how those other elements are used. All of that needs to be modeled and simulated together using a realistic workload. Changes in comput- ing requirements complicate this problem. For example, in data centers where generative AI has significantly increased the amount of data to be processed, the result is higher processor and memory utilization. To achieve 3D IC integration, several key technologies are required, such as TSV, wafer thinning, and wafer/chip bonding. ese tech- nologies are important in providing thermal and electrical pathways between layers. 3D integration relies on TSV because it reduces package size and shortens the interconnection path. It allows shorter chip-to-chip intercon- nections and a minimum pad size and pitch. With components becoming both larger (e.g., for higher performance) and smaller (e.g., for IoT devices), how do you foresee packaging technologies adapting to this dual demand? Semiconductor packaging technologies are evolving rapidly to meet the dual demand for larger, high-performance components and smaller, more efficient ones for IoT devices. We are seeing several key architectural approaches. Technologies like 2.5D and 3D packaging, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) improve performance while maintaining a compact form factor. Heterogeneous integration reconciles the dual demand for enhanced performance and compact form-factor. is approach combines