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Design007-Dec2024

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20 DESIGN007 MAGAZINE I DECEMBER 2024 AI-driven Inverse Stackup Optimization Beyond Design Feature Column by Barry Olney, IN-CIRCUIT DESIGN PTY LTD / AUSTRALIA Artificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be mul- tifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for com- plex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements. is month, I explore inverse stackup opti- mization (ISOP), a machine learning-assisted framework that automates the stackup design process for advanced package design. ISOP changes the game by using machine learning to efficiently search for the best stackup design parameters that meet target

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