Design007 Magazine
Design007-Dec2024
Issue link:
https://iconnect007.uberflip.com/i/1530269
Contents of this Issue
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Articles in this issue
Design007 Magazine — December 2024
Feature Contents–Advanced Packaging and Stackup Design
Additional Contents
Column–A Stack of Advanced Packaging Info
Short–Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
Feature Q&A–Effects of Advanced Packaging and Stackup Design
Feature Article–Are Our Stackup Rules No Longer Valid?
Feature Column–AI-Driven Inverse Stackup Optimization
Interview–IPC, FED Partner for New Design Conference in Vienna
Short–New Research Used Plasma Dynamic Synthesis to Produce Carbide and Carbonitride
Feature Column–Advanced Packaging Technologies: Look Before You Leap
Feature Column–Impact of Advanced Semiconductor Packaging on PCB Stackup
Column–Designing for Reality: Solder Mask and Legend
Article–UHDI Bleeding-edge Manufacturing Applications, Part 2
Column–Another PCB Design Paradigm Shift in the Works
Top Ten Editor's Picks
Career Opportunities
Educational Resources
Advertiser Index and Masthead
Problems Solved — Subscribe to Our Magazines
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