Issue link: https://iconnect007.uberflip.com/i/1530269
8 DESIGN007 MAGAZINE I DECEMBER 2024 The Shaughnessy Report by Andy Shaughnessy, I-CONNECT007 A Stack of Advanced Packaging Info It's holiday time again. Where did the year go? I actually have a jump on decorating—I never took the mistletoe off my mantel. So it's only fitting that this issue on advanced packaging and stackup features a "stackup" of "packages" on the cover. ere's certainly a lot to "unpack" in this issue. (Okay, I'll stop.) As advanced packaging moves further into the mainstream of PCB design, more PCB design- ers and design engineers are realizing this isn't a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular. Advanced packages usually require HDI or UHDI technology, which demands sequen- tial lamination. When designing boards with advanced packages, designers must choose materials that can withstand multiple lamina- tion thermal cycles. ese high-speed materi- als are ultra-thin and without reinforcement, which can lead to challenges with layer-to-layer misregistration. Sequential lamination requires plating on the inner layers. It all adds up to more potential DFM issues during fabrication. But with a little research, planning, and col- laboration with the fabricator, any seasoned