Design007 Magazine

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• Design007 Magazine — December 2024
• Feature Contents–Advanced Packaging and Stackup Design
• Additional Contents
• Column–A Stack of Advanced Packaging Info
• Short–Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
• Feature Q&A–Effects of Advanced Packaging and Stackup Design
• Feature Article–Are Our Stackup Rules No Longer Valid?
• Feature Column–AI-Driven Inverse Stackup Optimization
• Interview–IPC, FED Partner for New Design Conference in Vienna
• Short–New Research Used Plasma Dynamic Synthesis to Produce Carbide and Carbonitride
• Feature Column–Advanced Packaging Technologies: Look Before You Leap
• Feature Column–Impact of Advanced Semiconductor Packaging on PCB Stackup
• Column–Designing for Reality: Solder Mask and Legend
• Article–UHDI Bleeding-edge Manufacturing Applications, Part 2
• Column–Another PCB Design Paradigm Shift in the Works
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
• Problems Solved — Subscribe to Our Magazines