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72 PCB007 MAGAZINE I DECEMBER 2024 Interview by Andy Shaughnessy I-CONNECT007 At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrica- tion. is groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below. With its ability to integrate seamlessly into existing processes and equipment, this promises to meet the evolving needs of fabricators, particularly in UHDI and high-frequency products. Andy Shaughnessy: Matt and Ken, you have a material that's actually been used in the packaging world for quite some time, but you are now introducing it into PCB fabrication. Is this addressing a long-time need? Matt Lake: I've been in this industry for the better part of 42 years as either a laminate or board manufacturer. At least once a month, a board supplier has said to me, "Can you supply us with your resin simply cast onto a film for applications where we need to fill heavy cop- pers not necessarily for via fill?" NAMICS has been making this material for a long time but for a different industry. Tradi- tionally, films that are thermoplastics just don't NAMICS Brings Innovative Thermoset Materials to PCB Fabrication Matt Lake