Issue link: https://iconnect007.uberflip.com/i/1531384
52 DESIGN007 MAGAZINE I JANUARY 2025 Designers Notebook Feature Column by Vern Solberg, CONSULTANT Addressing Future Challenges for Designers e printed circuit board is and will prob- ably continue to be the base platform for most electronics. With the proliferation of new gen- erations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board's cost target. e printed circuit design engineer's prominent position demands the development of efficiently manufacturable products that perform without compromise. Planning the PCB Design A significant challenge for the designer is overcoming space constraints because of the increasing number of signal conduc- tors, increased component density, and the expanded number of component terminals. is can impede the designer's effort to create the most efficient circuit routing paths. Cir- cuit routing becomes more challenging as the spacing between terminal lands decreases. With increasing component density and decreasing board area, designers must use extra circuit layers for subsurface routing.