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26 DESIGN007 MAGAZINE I JANUARY 2025 › Utilizing cloud-based collaboration with external suppliers, such as with fabrica- tion and assembly, will enhance tighter, more efficient, and better optimized inte- gration and collaboration. • Material science breakthroughs: Higher performance requirements push the need for materials with better thermal, electri- cal, and mechanical properties. Advanced substrates like graphene will enable smaller, faster, and more durable devices. e key here will be tight integration and collabora- tion with the external suppliers. › Low-loss materials for high-speed and high-frequency designs › ermal management materials for heat dissipation in power electronics › Environmentally friendly, Pb-free mate- rials in line with stricter regulations • Digital twins/augmented reality (AR) for design and prototyping: Designers will use digital replicas for enhanced visualiza- tion and collaboration to simulate PCB performance under varying conditions, reducing prototyping costs and time-to- market. Implementing, utilizing, and effi- ciently wielding advanced EDA tools will be the norm. › AR tools for visualizing multilayer PCBs in 3D › Collaborative platforms for real-time design reviews and feedback • Internet of things (IoT) and edge devices: IoT devices demand low- power, compact, and cost- effective PCBs. › Integration of wireless modules like Bluetooth, Wi-Fi, and LPWAN into PCBs › Ultra-low-power designs for battery-operated devices • Multi-board systems and system-in-package (SiP): Devices increasingly consist of multiple interconnected boards or sys- tems on a single substrate. › Advanced interconnection techniques between PCBs › SiP designs for combining processors, memory, and other components • Sustainability in PCB design: Increas- ing emphasis on eco-friendly designs and manufacturing processes. › Use of recyclable and biodegradable materials › Designs that minimize waste and energy consumption during manufacturing • Enhanced testing and validation: As designs grow complex, ensuring reliability is critical. › More sophisticated design for testability (DFT) techniques › Automated optical inspection (AOI) and X-ray inspection for quality assurance • Integration of quantum electronics: With quantum computing on the horizon, designers must address new challenges, such as cryogenic environments and qubit management. By staying ahead of these trends, PCB design- ers can remain competitive and prepared for the evolving challenges and opportunities in the industry.