Issue link: https://iconnect007.uberflip.com/i/1531384
50 DESIGN007 MAGAZINE I JANUARY 2025 is class will inspire you to transform your vision into tangible innovations—keeping you ahead of the curve. AI-assisted DFM in THT Solder Joints Dr. Reinhardt Seidel • DEEPTRONICS Why is your PEDC class important? is class focuses on how tomorrow's PCB designs will shape the manufacturing process and overall product quality. Decisions made at the design stage have a direct impact on how easily and reli- ably a PCB can be assembled and sol- dered. THT solder- ing quality, in partic- ular, depends heavily on the PCB layout and its design consid- erations. By imple- menting robust DFM checks early on, costly quality issues and rework can be prevented. What can attendees expect from your class? Attendees will learn why traditional design rule checks oen fail to ensure THT solder joint quality. ey'll see how complex, non-lin- ear relationships between PCB design param- eters and soldering outcomes make it challeng- ing for existing methods to guarantee consis- tent results. rough real examples, the class will highlight the limitations of human experts working with outdated approaches. Partici- pants will gain insights into next-generation methodologies that can improve predictability and reliability in soldering processes. What do you hope each attendee takes away from your class? Ideally, attendees will recognize the grow- ing importance of simulation and AI-based approaches over static design rules in PCB design. ey'll see that these advanced tools can help predict issues before they happen, significantly reducing trial-and-error cycles during prototyping. By embracing AI-driven simulations, engineers can achieve better time-to-market, first-pass yields, and more robust manufacturing workflows. In short, the contribution aims to inspire a more informed, data-driven approach to PCB design and sol- dering challenges. DESIGN007 Dr. Reinhardt Seidel