JANUARY 2025 I DESIGN007 MAGAZINE 71
In this interview,
Kris Moyer shares
his thoughts on
the relationship
between packaging
and stackup, what
PCB designers
need to know, and why he believes, "The
rules we used to live by are no longer valid."
Are the stackup rules we used
to follow no longer valid?
It depends on what you're
designing. Electrical rules
change depending on your cir-
cuit. Fabrication rules change depending on which
fabricator you're working with. Today, we just have
more options, and sometimes, cost is a bigger rule
than anything else.
In the previous episode of I-Connect007's On
the Line with… podcast, we discussed the strip,
etch, and strip process. At this point, we have
a functioning
board, but
we still need
to protect
the PCB from
environmental
effects and document the circuit components.
This brings us to the solder mask and legend
phase of production.
Copper foil is the standard conductive
layer used for metal-clad laminates,
although other options are available.
There are two main types of copper foil
used for PCB boards today: electrode-
posited (ED) foil and rolled annealed
(RA) foil. ED copper foil is produced by a
continuous process which yields a well-
controlled product in mass volume and
low cost as compared to RA copper foil.
For the latest news and information, visit PCBDesign007.com
Connect the Dots: Designing for
Reality—Solder Mask and Legend
Effects of Advanced Packaging
and Stackup Design
Are Our Stackup Rules
No Longer Valid?
BOOK EXCERPT: The Printed
Circuit Designer's Guide to...
High Performance Materials,
Chapter 4: Copper Foil
Ultra high-density interconnect (UHDI)
technology is transforming manufac-
turing by enabling compact, high-
performance, and energy-efficient
electronics in cutting-edge industrial
systems. Its precision and scalability
meet the demands of advanced manu-
facturing technologies.
UHDI Fundamentals: UHDI
Bleeding-edge Manufacturing
Applications, Part 2
The Pan-European
Electronics Design
Conference (PEDC) takes
place Jan. 29-30 at the
NH Danube City hotel in
Vienna. Raytheon's Filbert
Arzola is presenting
"Engineering and Adapting Model-based PCB
Design in Step with Sustainability and Digital
Twins" at PEDC. I asked Filbert to discuss
what attendees can expect from his class.
Spotlight on PEDC: Filbert Arzola
