IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1531444
IPC COMMUNITY 84 WINTER 2025 W ith the ever-increasing rate and pace of technology adoption in the mar- ketplace, the electronics industry is experiencing significant disruption. Many new technologies have heightened geopolitical pressures and new business models, and, simultane- ously, regional/global supply chain shifts are chang- ing dramatically. Now more than ever, it is essential that companies stay on top of the latest advancements in technology and supply chain shifts by understanding the impacts these changes have on their businesses both in the near and long term. In response, the mis- sion of the IPC Technology Solutions Team is to drive next-generation technology advancements and supply chain transformation across the electronics industry. The team identifies critical industry needs and challenges and works to develop new solutions by collaborating with governments, academia, companies, other associations, and IPC members worldwide. IPC Technology Solutions considers that: • Investments must be made to strengthen inter- nal IPC technical expertise and capabilities to better serve the global electronics industry. • It must identify and develop solutions with a mid-term and long-term outlook. • It operates internationally to solve challenges within regional and global supply chains span- ning North America, Europe, and Asia. • Collaboration with other associations, partners, and work groups is essential for the successful deployment of new industry solutions. • It must work across all IPC functions, including Advocacy, Standards, Education, and Events. By Matt Kelly, IPC CTO and Vice President Technology Solutions The IPC Technology Solutions Team The team's top priority is ownership and delivery of new solutions across four key IPC initiatives: • Design, led by Dr. Peter Tranitz • Advanced packaging, led by Dr. Devan Iyer and Matt Kelly • Factory of the Future, led by Chris Jorgensen • eMobility, led by Tracy Riggan They strategically manage various core technol- ogy areas, including design, system- and compo- nent-level packaging, PCB/HDI/UHDI, EMS/PCBA, wire harness, and final system assembly domains. In addition, the team oversees IPC's emerging technol- ogy pipeline that includes e-textiles, additive manu- facturing, and plastronics by evaluating and assess- ing when new solutions need to be developed. This is underpinned by the need for sustainable electronics practices. The Solutions Team works closely with Dr. Kelly Scanlon, IPC lead sustainability strategist, to ensure that deliverables being worked on by the team meet sustainability initiative goals for IPC and the industry and support the develop- ment of new solutions for sustainability. The Solutions Team has created and implemented a "silicon to systems" approach, which expands upon PCB/PCBA legacy capabilities. Focused expan- sion into electronic components and component packaging, as well as final system-level assembly, allows the team to explore and deliver new solu- tions to OEMs, IDMs, OSATs, and IC-substrate fabri- cators, extending beyond traditional PCB and EMS markets. Technology solutions efforts are driven by the input of leadership councils, including the Chief Technologist Council (CTC), the Design Leadership Council (DLC), and industrial and academic part- nerships. These groups provide industry-influencing thought leadership and research, networking events, and technical guidelines in digitalization, design tools, and the development of new workforce devel- opment programs. MEET THE TEAM IPC COMMUNITY 84 WINTER 2025