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Challenges and Considerations of Harsh Environments The Knowledge Base by Mike Konrad, SMTA 56 SMT007 MAGAZINE I FEBRUARY 2025 In today's rapidly advancing technological landscape, electronic assemblies are increas- ingly being deployed into environments that push their design and material limits. From the corrosive atmospheres of industrial facili- ties to the extreme temperatures and humid- ity of outdoor applications, harsh environ- ments present a significant challenge to the reliability of electronic devices. is column explores the key issues impacting electronics reliability in such conditions, including elec- trochemical migration (ECM), corrosion, and the role of residue tolerance in assem- bly design. We'll also examine how specific design considerations, such as the distinction between through-hole and surface-mount technology (SMT), impact the resilience of electronics in these demanding scenarios. Understanding Reliability in Harsh Environments Electronic reliability refers to the ability of a device to perform its intended function with- out failure over a specified time. Harsh envi- ronments—characterized by extreme temper- atures, high humidity, salt fog, dust, and cor- rosive gases—exacerbate the risk of failure by accelerating degradation processes. Reliabil- ity in such contexts depends on a confluence of factors, including material selection, design architecture, manufacturing processes, and environmental controls.