Issue link: https://iconnect007.uberflip.com/i/1532052
FEBRUARY 2025 I SMT007 MAGAZINE 53 demia and institutes, engaging with enthusiasts and students who are passionate about electron- ics and must be empowered to drive the future. Providing education and resources is essential to empowering the next generation, which is one of our aims at J.A.M.E.S. Many of our use cases serve as showcases. ese are examples that are not qualified prod- ucts at the moment. However, we are learning valuable lessons from each one. As a moderator for J.A.M.E.S, we actively engage with the industry, identifying its needs and facilitating collaboration between material and printer providers. We have nearly 12,000 registered users on our online platform plus followers on social media. Awareness is grow- ing. As the university experts use machines, they are designing new things. In France, there is the company, HUMMINK, able to repair at chip level on wafers. Testing and repairing small chips and pack- ages is noted as a significant challenge for the industry that must eventually be addressed for cost. What are the mechanical processes of micro-dis- pensing and capillary printing? Capillary printing uses a very tiny, needle-like instrument down to the micron or submicron. It's not possible to print bigger applications with that kind of printer. In the case of heteroge- neous integration on the chip level, this would be relevant to a specific product. en, you can interconnect to the next printed-level chips or a PCB. FED additively printing solder mask. Hummink's semiconductor-level printing application. I see that tiny needle on a wafer and it's really hard to wrap my head around. We're not talk- ing about ink droplets. Is it an aerosol gas? It is something like a pencil or a pen, not a gas. ey are using capillarity effects to draw on a surface. ere are no sprays or satellite drops like in inkjet printing; they can draw the tiniest dimensions. When you have the right inks, you can build small towers. is is another use case. In this instance, packaging a particular semiconductor was not possible using traditional methods because we couldn't source the package due to COVID-related supply chain issues. How- ever, we had a printer (the DragonFly IV System, Nano Dimension), which enabled a highly innovative approach. Using our design platform, we created a unique structure. Ini- tially, we thought of it as an interposer, but it turned out to be something entirely new, a smart package or cyber-IT-relevant package. Because we had the machine, we printed the solder balls ourselves, using the inkjet process