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86 PCB007 MAGAZINE I MARCH 2025 e outlook for ABF substrate manufactur- ing in North America is optimistic, with sig- nificant growth anticipated in the coming years. Industries such as 5G communications and cloud computing are driving the demand for advanced packaging solutions. Addition- ally, sectors like defense and aero- space are increasingly adopting ABF substrates due to their reli- ability and performance in criti- cal applications. We are proud to offer compre- hensive solutions and support for the substrate manufacturing pro- cesses. We know these technolo- gies and process improvements will be increasingly sought aer as elec- tronics manufacturing advances toward building these necessary technologies and applications. It sounds like all4-PCB is positioned for contin- ued growth and success in the ever-evolving world of PCB and substrate manufacturing. We're excited about the future and look for- ward to continuing to support our customers with cutting-edge solutions. PCB007 By Pete Starkey The ICT Spring Seminar held on March 5 near Tewkesbury, UK, heralded an inspiring shift in the field of PCB technology, particularly focusing on alternative metal finish- es. Led by ICT Chair Mat Beadel and technical director Emma Hudson, the seminar emphasized the growing de- mand for high-frequency and radio- frequency PCBs, as articulated by keynote speaker Erik Pedersen from ICAPE. He highlighted the limitations of traditional electroless nickel immer- sion gold (ENIG) finishes, especially concerning per- formance at higher frequencies due to issues relat- ed to nickel's ferromagnetic properties. The innovative solution presented was autocat- alytic silver immersion gold (ASIG), which address- es these frequency challenges by minimizing inser- tion loss and providing excellent surface protection. Pedersen shared results from ICAPE's comparative ICT Spring Seminar: Nickel Not Welcome Here study, indicating significant performance improve- ments with ASIG over ENIG in several PCB designs. Additionally, Daren Caruana from University College London intro- duced an exciting advancement in manufacturing techniques: a novel non-contact atmospheric-pressure plasma deposition method, allowing for efficient metal deposition without the need for pre-treatment. This rev- olutionary technique opens doors for the application of various metals, en- abling faster and more sustainable production of printed electronics. The seminar showcased new possibilities and the evolving landscape of PCB manufacturing, ul- timately encouraging a shift away from traditional methods to innovative approaches that can meet modern demands. Read the full article here.