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MARCH 2025 I PCB007 MAGAZINE 85 the surface remains free of debris while curing the ABF films with highly precise cur- ing profiles. Will you explain how this touchless cleanliness curing process works? To achieve a touchless cur- ing process for ABF cores, GroupUp's automated solu- tion involves loading up to 20 cores onto specialized frames, which are then stacked onto a trolley or cart system. A robotic arm transfers the entire rack of frames into the oven chamber for curing. Once the cur- ing cycle is complete, the robotic arm unloads the processed materials, maintaining a touch- less operation throughout the process. is method ensures consistent curing qual- ity, reduces contamination risks, and improves overall production efficiency by automating the loading and unloading stages of the curing process. What's next after the build-up layer application? Aer the build-up layer, the next critical step is microvia forming. For this, we have Tongtai's combo UV/CO 2 laser drill machine, which can form vias down to 30 microns and offer even higher capabilities, drilling vias as small as 10 microns in diameter with advanced packaging equipment. Following microvia drilling, we also focus on the desmear process. Plasma equipment is essential for treating residual resin in holes, especially those with high aspect ratios to 10 microns and below. For years, we've had great success working with Boffotto, an industry leader in plasma desmear technology. What else is on the horizon for you? Are there any new partnerships or innovations in development that you can talk about? Yes, we recently partnered with SAS-Soec out of Germany. SAS specializes in metalliza- tion, including chemical desmear for micro- vias. e technology is highly sought aer for preparing substrates for additive plating, spe- cifically electroless copper plating. e pro- cess lines help achieve uniform copper depo- sition, ensuring high adhesion to the surface. SAS is capable of supporting both small and large batch-scale lines, which is not something everyone can do in this space. And Temgtai offers vertical touchless pro- cess equipment for dry film developing as well as flash etching capabilities and dry film strip- ping. is technology achieves high yields and ultra-uniformity with its unique spray config- uration, making it perfect for high-precision applications. We have added that to our line of equipment as well. It seems that all-4PCB has made a significant commitment to supporting substrate manu- facturing with a broad range of equipment and solutions. As far as the development of that market, what do you see for substrate manufacturing in North America? " SAS is capable of supporting both small and large batch-scale lines, which is not something everyone can do in this space. " (Source: SAS)