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Enabling Zero Touch Data Transfer What will it take to realize this vision across the industry? e push must come from designers and EMS providers—the stakeholders most affected by inefficiencies and poor data quality. Some large organizations have already implemented many elements of Zero touch data workflows. To accelerate adoption, quality assurance teams must broaden their focus. Instead of only tracking product defect rates, they should also measure and report on data package defect levels. is metric would shine a light on the hidden cost of poor documentation and pro- vide a catalyst for change. 14 DESIGN007 MAGAZINE I MAY 2025 Zero touch data transfer is not a far-off dream. e tools and standards exist today. What's needed is a cultural shi: a refusal to accept defective data and an embrace of mod- ern, intelligent formats like IPC-2581. By doing so, we can reduce costs, improve quality, and accelerate time-to-market across the PCB manufacturing ecosystem. DESIGN007 Dana Korf is senior director of technology at Victory Giant Technology and founder of Korf Consultancy. The exponential miniaturization of electronic chips over time, described by Moore's law, has played a key role in our digital age. However, the operating power of small electronic devices is significantly limited by the lack of advanced cooling technologies available. Aiming to tackle this problem, a study published in Cell Reports Physical Science, led by researchers from the Institute of Industrial Science, The Univer- sity of Tokyo, describes a significant increase in per- formance for the cooling of electronic chips. The most promising modern methods for chip cool- ing involve using microchannels embedded directly into the chip itself. These channels allow water to flow through, efficiently absorbing and transferring heat away from the source. A Cool Fix for Hot Chips: Advanced Thermal Management Technology for Electronic Devices The efficiency of this technique is constrained, however, by the sensible heat of water. This quan- tity refers to the amount of heat needed to increase the temperature of a substance without inducing a phase change. The latent heat of phase change of water, which is the thermal energy absorbed during boiling or evaporation, is around 7 times larger than its sensible heat. Previous research has shown the potential of two- phase cooling, while also highlighting the complica- tions of this technique, primarily due to difficulties in managing the flow of vapor bubbles after heating. Maximizing the efficiency of heat transfer depends on a variety of factors, including the geometry of the microchannels, the two-phase flow regulation, and the flow resistance. This study describes a novel water-cooling system comprising three-dimensional microfluidic channel structures, utilizing a capillary structure and a mani- fold distribution layer. The researchers designed and fabricated various capillary geometries and studied their properties across a range of conditions. High-performance electronics rely on advanced cooling technology, and this research could be key in maximizing the performance of future devices and achieving carbon neutrality. (Source: University of Tokyo)