Design007 Magazine

Design007-May2025

Issue link: https://iconnect007.uberflip.com/i/1535183

Contents of this Issue

Navigation

Page 41 of 85

Solder Paste Preforms Cored Wire Solid Solder Liquid Flux Edgebond Underfill Adhesives Conformal Coatings Potting Compounds Thermal Pastes Pre-Cured Gels Liquid Gap Fillers Gap Filling Pads Thin Dielectric Sheets Pioneering Solutions for Optimal PCB Assembly Performance CONNECT REINFORCE PROTECT THERMAL Reduce Total Cost of Ownership Enhance Thermal and Electrical Conductivity Improve Reliability, Enabling Complex Board Designs Meet Compliance and Sustainability Standards © 2025 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. macdermidalpha.com

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-May2025