Design007 Magazine

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• Design007 Magazine — May 2025
• Featured Contents — Creating the Ideal Data Package
• Additional Content
• Feature Column — Solving the Data Package Puzzle
• Short — Yonsei University Researchers Uncover Evidence of Wigner Crystals, Electronics Rotons
• Feature Article — Zero Touch Data Package: The Future of Seamless PCB Manufacturing
• Short — A Cool Fix for Hot Chips: Advanced Thermal Management Technology for Electronic Devices
• Feature Interview — Standards: The Roadmap for a Flawless Data Handoff
• Feature Article — Defining the Ideal PCB Design Data Output
• Feature Column — Design Data Packages: Circle of Concern or Circle of Influence?
• In-Depth with… MacDermid Alpha — Advancements in High-reliability Alloys for Automotive and High-performance Applications
• MilAero007 Highlights
• Feature Column — From Dream House to Drill Files
• UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Smart Homes
• Column — Proactive Controlled Impedance
• Short — Understanding Global Citizenship as a Competitive Advantage
• Interview — Insights Into a Differentiating Trade/Investment Global Strategy for Electronics
• Short — The Printed Circuit Designer's Guide to… DFM Essentials, Chapter 9: Data Formats
• Feature Column — Radiation and Interference Coupling
• Article — High-frequency EMC Noise in DC Circuits
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead