Issue link: https://iconnect007.uberflip.com/i/1535183
When did you release your new reworkable product line? Rehman: The HiTech CF31-4026 edgebond was released in Q1 of 2025, but we have been working on developing this solution for more than three years. What are you working on that might be released in the next three or four years? Rehman: We're seeing several promising developments, partic- ularly in the area of high-reliability materials. Upcoming innovations include advanced alloys, high- performance polymers, and next- generation conformal coatings designed to enhance durability and environmental resistance. Let's discuss the alloys. What are their applications; who is using them, and why? Rehman: SAC-305, composed of tin (Sn), silver (Ag), and cop- per (Cu), is currently the indus- try standard for lead-free sol- der, with an estimated 90% adop- tion rate across the electron- ics sector. However, over the past decade, driven largely by advancements in Advanced Driver-Assistance Systems (ADAS) and the increasing reli- ability demands of automotive control architectures—the auto- motive industry has begun shift- ing away from SAC-305. Instead, it's utilizing the benefits of higher- reliability alternatives such as Innolot and other enhanced sol- der formulations designed to withstand harsher operating environments. What was the impetus behind this? What problems were you solving? Rehman: The entire idea behind increasing reliability is to increase your in-use life. We look at extended thermal cycling profiles for certain applications. Let's say we set the industry standard now at a -40°C to +125°C temperature window, and if you pass that for a certain number of cycles, then you are a qualified product. Today, given the demand for increased reliability, for certain applications, we are seeing a -40°C to +150°C requirement. That's a shift of 25 degrees Celsius on the higher end that pushes your solder joints or your assembly to its limits. The main thing is ensuring your assembly performs seamlessly at operational temperatures with- out failures. Our products are helping our customers achieve this goal by delaying failure and ensuring that at the higher tem- perature, the degradation in your solder joint is minimal. SAC-305 performs well, but after a certain number of thermal incursions, you start to see the alloy degrada- tion accelerate. With current and new alloys that are more focused on high-reliability applications and creep resistance, degrada- tion is slowed, or the crack propa- gation and initiation require more dislocation energy. What about applications for aerospace and outer space? Rehman: We have a good pres- ence in the aerospace and sat- ellite market segments as well. In the past, those were govern- ment-driven and primarily tin- lead solders. But with the privati- zation in that sector, we see that many are adopting high-reliability alloys in aerospace. Let's talk about the third area— electrochemical reliability. Rehman: Electrochemical reli- ability means how your assem- bly behaves when it is exposed to higher temperatures and humid- ity. Given that water is a conductor of electricity, there are chances that flux residue may be left on the board for no-clean pastes that could become conductive over time and start conducting ions