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78 PCB007 MAGAZINE I JUNE 2025 • ermal management: With its excellent thermal conductivity, copper efficiently dissipates heat generated by electronic components, improving the PCB's thermal performance and overall reliability • Corrosion resistance: Proper copper plat- ing and surface finishes shield the PCB from oxidation and environmental corro- sion, ensuring long-lasting durability and reliability in diverse conditions Nevertheless, copper electroplating is a com- plex process, and achieving the desired enhanced properties for a PCB can be challenging. e success of this process hinges on the precise con- trol and management of key parameters (such as current density, voltage, bath chemistry, tem- perature, agitation, and plating time) that influ- ence its efficiency and effectiveness. Another important consideration is the evolution of PCB technology, which now fea- tures smaller vias and thicker boards. As vias shrink and board thickness increases, ohmic resistance through the vias rises, making it harder to achieve an even copper distribu- tion 2 . From an operational perspective, sev- eral adjustments are required, including smart PCB design, tank infrastructure improve- ment, optimizing plating racks to sufficiently conduct electricity, creating new additives to enhance throwing power, and adjusting volt- age and amperage to ensure proper chemical penetration into the vias. Moreover, reducing cathodic current density is crucial for improv- ing plating distribution and decreasing the sur- face-to-hole ratio. Achieving adequate copper plating thickness is essential to meet and sur- pass long-term reliability standards. Automated copper thieving: The basics Copper electroplating, as well as copper etching are essential processes in PCB fabri- Figure 1: Left Image: Displays the current density distribution across the board caused by manu- ally added copper thieving. The black circle high- lights a surface area on the board (marked by a red spot) where the current density is exces- sively high. This can lead to uneven plating and excessively thick copper deposition in that region. Right Image: shows the current density distribution achieved through automated copper thieving oper- ations. The black circle highlights the previously risky surface area, which has now been mitigated by precise amount and placement of copper thiev- ing. This results in a balanced current density distri- bution (marked by a green spot).