34 DESIGN007 MAGAZINE I JULY 2025
UHDI Applications Across
Industry 4.0 Domains
Smart Manufacturing Systems
• UHDI facilitates integration
of AI and machine learn-
ing processors directly on
equipment
• Enables high-bandwidth
data transmission between
control units and sensors
IIoT Devices and Networks
• UHDI supports ultra-com-
pact, multi-functional IoT
nodes
• Enhances edge processing
capabilities to reduce late-
ncy and bandwidth needs
Robotics and Autonomous
Platforms
• UHDI boards reduce weight
and space requirements
• Improves sensor-actuator
response time and integra-
tion density
Augmented Reality and
Wearables for Industry
• Enables lightweight, bat-
tery-efficient AR systems
for diagnostics and training
• Improves ergonomics while
maintaining high perfor-
mance
Benefits of UHDI in Industrial
Contexts
• Space efficiency: Smaller
devices fit into tighter
industrial enclosures
• Signal integrity: Reduced
cross-talk and EMI for real-
time control
• Reliability: Enhanced ther-
mal and mechanical perfor-
mance in harsh conditions
• Power efficiency: Shorter interconnects and embedded com-
ponents reduce power loss
Future Outlook and Research Directions
• Integration with 5G/6G industrial networks for ultra-reliable low-
latency communication
• Development of flexible and biocompatible UHDI substrates for
wearable industrial tech
• Synergy with chiplet-based architectures for scalable edge AI
systems
• Use in green electronics initiatives through material reduction
and energy efficiency
Conclusion
UHDI technology is foundational to the success of Industry 4.0. By
enabling the compact, powerful, and interconnected systems that
modern smart factories require, UHDI is bridging the gap between
miniaturization and industrial robustness. Its role will only grow as
demands for intelligence, efficiency, and sustainability increase in
industrial ecosystems.
DESIGN007
Anaya Vardya is president and CEO of American
Standard Circuits; co-author of The Printed
Circuit Designer's Guide to… Fundamentals of
RF/Microwave PCBs
and Flex and Rigid-Flex
Fundamentals. He is the author of Thermal
Management: A Fabricator's Perspective,
The Printed Circuit Designer's Guide to DFM
Essentials, and The Companion Guide to Flex and Rigid-Flex
Fundamentals
. Visit I-007eBooks.com to download these and
other free, educational titles.
Key Industr y 4.0 re quirements enable d by UHDI
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