Issue link: https://iconnect007.uberflip.com/i/1537616
6 PCB007 MAGAZINE I JULY 2025 Columns A Growing Presence in Washington in Turbulent Times by Shane Whiteside Inner Layer Alignment Methods in PCB Production by Kurt Palmer Metallizing Flexible Circuit Materials: Mitigating Deposit Stress by Michael Carano Sustainability and Circularity for Electronics Manufacturing by Happy Holden Interviews Beyond Recycling: Reshaping Sustainability in Electronics with Kelly Scanlon and Corey Dehmey Articles Leveraging Chemical Data More Efficiently by Lynn L. Bergeson Advancements in Electrolytic Cu Plating for AI-driven IC Substrates by Dirk Ruess and Mustafa Oezkoek Direct Metallization: A Sustainable Shift in PCB Fabrication by Jim Watkowski Highlighting Jerry Siegmund by Dan Feinberg 14 38 72 82 22 34 62 76 90