Issue link: https://iconnect007.uberflip.com/i/1537616
JULY 2025 I PCB007 MAGAZINE 65 In this study, the Cuprapulse® pulse plating electrolyte was specifically engineered to deliver exceptional performance on high-density IC sub- strates with strict uniformity requirements. Its for- mulation supports precise control over copper deposition, even in panels with complex geome- tries and variable hole densities. Uniform copper thickness across the substrate surface is a critical parameter in advanced pack- aging, particularly for high-frequency and high- I/O-density circuits commonly found in AI and HPC hardware. Inconsistent plating can compromise signal integrity, reliability, and yield. By combining this chemistry with vertical con- veyorized pulse plating systems, this approach ensures: • Superior throwing power in dense and isolated through-hole areas • Minimized surface thickness variation • Enhanced overall circuit performance This synergy between chemistry and equipment is essential to enabling next-generation AI sub- strates that meet the highest standards of electri- cal functionality and manufacturing precision. Key Factors Influencing Uniformity Achieving uniform copper deposition across pack- age substrates is a critical performance require- ment, especially in high-density applications such as AI and HPC hardware. While chemical formu- lation plays an important role, panel-level copper uniformity is primarily governed by the design and configuration of the plating equipment. Modern vertical continuous plating (VCP) sys- tems, such as those used in package substrate manufacturing, incorporate advanced features like customizable shielding, precision anode architec- ture, and automated loading systems to meet strin- gent quality standards. ▼ Figure 4: Pro c ess flow of pulse c opp er plating ele ctroly te. ▼ F i g u re 5 : Eq u i p m e nt fa cto rs i nf l u e n c i n g u n i fo r m i t y a n d af fe cte d p a n e l a re a s .