Issue link: https://iconnect007.uberflip.com/i/1537616
66 PCB007 MAGAZINE I JULY 2025 Optimizing Top and Bottom Uniformity To maintain uniform plating, specific mechanical and process controls are essential: • Top-side uniformity depends on maintaining consistent solution levels, properly adjusted shielding, and stable clamping, assuming cor- rect operation of the automatic loading sys- tem • Bottom-side uniformity requires an optimized anode configuration, with sacrificial burning bars providing additional control over depo- sition in lower panel regions • Independently adjustable shielding at the anode and cathode enables fine-tuning across varying panel designs and dimen- sions, ensuring uniform coverage from top to bottom Addressing Leading and Trailing Edge Issues While global parameters like anode shielding and level settings help control top and bottom unifor- mity, they apply uniformly to all panels. In contrast, leading and trailing edge effects—where electrical current concentrates at panel edges—require indi- vidualized solutions. As panels travel through the VCP system, cur- rent crowding at the front and back edges can cause over-plating. This effect is exacerbated when panel spacing or alignment is inconsistent, even in continuous production. Importance of Jig Design This challenge highlights the critical role of jig design between panels. Specially designed jigs collect excess current and prevent over-plating at the panel edges. They are tailored to the specific design of each panel, ensuring that the current is evenly distributed across the entire panel. How- ever, traditional jig solutions come with economic and environmental drawbacks, such as increased current usage and the need to manage excess plating material after processing. vPlate®: A Smarter VCP System To address these limitations, the vPlate vertical continuous plating system integrates specially designed jigs and high-precision panel alignment within the copper plating module. This advanced system ensures: • A consistent and adjustable inter-panel gap • Enhanced edge uniformity without excessive plating • Greater overall process efficiency with reduced material waste By combining smart jig technology with refined equipment architecture, this plating system repre- sents a next-generation approach to uniform cop- per deposition in complex package substrate man- ufacturing. ▼ v P l ate w i t h l ate st p u l s e p l at i n g te c h n o l o g y fo r h i g h h o l e d e n s i t y p l at i n g of I C s u b st rate s .