Issue link: https://iconnect007.uberflip.com/i/1538100
40 SMT007 MAGAZINE I AUGUST 2025 innovation and meeting product design schedules. Paul Salerno, director of SMT & Preforms, said, "Accurately pre- dicting and validat- ing connection per- formance with data is a foundational require- ment for innovation and consistently meeting product design schedules." From Data to Decisions The Reliance tool supports early decision-making by empowering a range of users, from process engineers to quality managers, with actionable insights. Visual- izing trade-offs and performance outcomes enables smarter mate- rial selection and supports cross- functional alignment in material decisions. This offers significant value in today's workforce, where vary- ing training levels and tight time- lines can impact efforts to facil- itate the efficient adoption of advanced technologies. The tool's intuitive design helps bridge that gap, making high- reliability solutions more accessi- ble than ever. Beyond SAC305: Tailored Material Strategies for Application-specific Reliability While SAC305 remains the industry-standard lead-free sol- der alloy, its performance under high thermal and mechanical stress can be limiting in demand- ing environments. As reliabil- ity expectations rise across the above mentioned sectors, engineers increasingly turn to advanced material systems to address application-specific challenges. Integrated Solutions for Reinforced Reliability Alloys like MacDermid Alpha Innolot®, with enhanced creep resistance and thermal fatigue performance, offer a significant upgrade over SAC305. When paired with ALPHA® HiTech® edgebond, which mechanically anchors components to the PCB, these materials help mitigate cracking and delamination under prolonged stress. Innolot also provides improved resistance to thermal fatigue, while ALPHA HiTech underfill helps distribute mechanical stress in densely packed packages like BGAs and chiplets. These materi- als ensure the long-term reliabil- ity required in data centers and automotive applications, where even minor failures can trig- ger cascading effects. Addition- ally, ALPHA HiTech underfills and edgebonds are crucial in improv- ing mechanical shock resistance. Combined with high-reliability alloys, these solutions help main- tain solder joint integrity in ultra- compact, high-density designs like smartphones. Making the Right Choice: Data-driven Material Selection The decision to move beyond traditional alloys such as SAC305 should be grounded in application-specific reliability data. Tools like Reliance enable engineers to compare solder alloys and reinforcement materi- als across standardized test con- ditions such as thermal cycling, SIR, and mechanical shock, pro- viding a clear picture of trade- offs and performance gains. By integrating high-reliability alloys like Innolot with targeted reinforcement strategies, engi- neers can design more robust interconnect systems that meet the evolving demands of modern electronics, without compromising manufacturability or cost targets. Conclusion: The First Step Toward BLR Board-level reliability is no longer a niche concern but a founda- tional requirement. As industries evolve and expectations rise, the ability to make informed, data- driven decisions about materials and interconnects will define the next generation of electronics. Whether in the air, on the road, or in the cloud, the path to reliability begins with insight and the tools to act on it. SMT007 Alan Gardner is strategic con- tent/business partner director at MacDermid Alpha Electronics Solutions. " " By integrating high- reliability alloys like Innolot with targeted reinforcement strategies, engineers can design more robust interconnect systems that meet the evolving demands of modern electronics, without compromising manufacturability or cost targets.